- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/525 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
Patent holdings for IPC class H01L 23/525
Total number of patents in this class: 1648
10-year publication summary
|
197
|
166
|
219
|
194
|
181
|
157
|
139
|
123
|
124
|
45
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
291 |
| International Business Machines Corporation | 60644 |
129 |
| Nanya Technology Corporation | 2000 |
65 |
| Intel Corporation | 45621 |
62 |
| Samsung Electronics Co., Ltd. | 131630 |
61 |
| GLOBALFOUNDRIES U.S. Inc. | 6459 |
50 |
| SK Hynix Inc. | 11030 |
46 |
| Micron Technology, Inc. | 24960 |
45 |
| Changxin Memory Technologies, Inc. | 4732 |
42 |
| Monolithic 3D Inc. | 270 |
41 |
| Renesas Electronics Corporation | 6305 |
34 |
| Texas Instruments Incorporated | 19376 |
31 |
| Qualcomm Incorporated | 76576 |
29 |
| United Microelectronics Corp. | 3921 |
26 |
| eMemory Technology Inc. | 358 |
25 |
| Infineon Technologies AG | 8189 |
18 |
| Rohm Co., Ltd. | 5843 |
18 |
| Xintec Inc. | 265 |
17 |
| Synopsys, Inc. | 2829 |
14 |
| GLOBALFOUNDRIES Singapore Pte. Ltd. | 734 |
14 |
| Other owners | 590 |